Our new collaborative paper about halogen bonding in organic semiconductors is out!
- ekaterinalisitsyna
- May 5, 2025
- 1 min read
Updated: Dec 17, 2025

A new scientific publication has shown that halogen bonding can be a powerful tool for boosting the performance of organic electronic devices, a breakthrough recognized by its selection as the cover article of the journal issue. By applying strong, directional halogen bonding to a pyridine-substituted naphthalene diimide (NDI) semiconductor, the study demonstrates how molecular packing and solid-state morphology can be precisely controlled—key factors governing charge transport in organic semiconductors.
Through systematic comparison of different halogen-bond donors and a nonbonding reference, the researchers achieved a two-orders-of-magnitude improvement in field-effect mobility and ION/IOFF ratio, with device performance strongly dependent on the geometric substitution pattern of the donors.
The work was carried out by Tero-Petri Ruoko in collaboration with Linköping University, University of Strasburg and University of Aveiro as well as with the SPM group. Congratulations to the authors on the great research achievement and well-deserved publication in Angewandte Chemie with the journal cover recognition. The full version can be read in Halogen Bonding as a Tool to Control Morphology and Charge Transport in Organic Semiconductors






